7 月 1 日，全球排名第一的半导体封装测试（OSAT）供应商日月光宣布再度调涨封装报价，涨价幅度最高超过 20%。
据Odaily星球日报报道，本次涨价品类涵盖各类先进封装技术，包括晶圆基板芯片封装（CoWoS）和扇出型基板芯片封装（FoCoS）。
日月光7月1日再调涨封装报价，最高超20%
2026-07-01 16:03:44
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