ASE, the world’s largest outsourced semiconductor assembly and test (OSAT) provider, announced on July 1 that it will raise packaging prices again, with increases of more than 20% at the high end.
According to Odaily, the latest price hike covers multiple categories of advanced packaging technologies, including chip-on-wafer-on-substrate (CoWoS) and fan-out chip-on-substrate (FoCoS).
STOCKS | ASE Raises Advanced Chip Packaging Prices by More Than 20%
2026-07-01 16:03:56
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日月光7月1日再调涨封装报价，最高超20%
