Shennan Circuits said its high-end printed circuit board (PCB) capacity expansion project supporting AI chips was expected to start trial production in the second half of 2026 and gradually ramp up capacity.
According to Jin10, the company disclosed an investor relations activity record stating that it planned in the fourth quarter of 2024 to invest about 4.3 billion yuan to build the project. Construction started in late June 2025 and is currently progressing in an orderly manner.
The company said it becomes fully involved at a very early stage of end-customer product development, including early participation in electrical performance verification and reliability testing for new-generation high-end materials. It said this helps shorten material certification cycles and secure priority allocation when supply is tight.
Shennan Circuits also said it has implemented strategic safety stockpiles for key materials and is accelerating diversification and localization certification to reduce the risk of raw material supply disruptions and strengthen supply chain resilience.
AI TRENDS | Shennan Circuits Says 4.3 Billion Yuan AI Chip PCB Expansion Project to Begin Trial Production in H2 2026
2026-07-06 10:32:38
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