SemiAnalysis said in a post on X that SPHBM4 shifts complex engineering burdens in AI chips.
According to Odaily, SemiAnalysis said chipmakers will no longer buy an expensive proprietary combination of “silicon interposer + ABF substrate,” and will instead fully shift to purchasing ultra-large, high-layer-count ABF substrates.
SemiAnalysis added that if performance requirements are pushed directly to the substrate layer, chipmakers may adopt glass substrates earlier.
The firm said the substrate boom is just beginning.
AI TRENDS | SemiAnalysis Says SPHBM4 Shifts AI Chip Engineering Burden to Substrates
2026-07-03 13:56:04
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