Has the loss reached 60 million US dollars? TSMC debunks rumors: wafer fab equipment recovery rate exceeds 70%
2024-04-04 02:54:42
On April 4th, regarding the impact of the earthquake, TSMC stated that although a few equipment in some factories were damaged and affected some production lines, the main machines, including all extremely ultraviolet (EUV) lithography equipment, were not damaged. "Within 10 hours after the earthquake, the recovery rate of wafer fab equipment has exceeded 70%, and the recovery rate of newly built wafer fabs (such as the 18th wafer fab) has exceeded 80%. TSMC is currently maintaining close communication with customers and will continue to closely monitor and communicate directly with customers in a timely manner regarding the impact." TSMC said.
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