红板科技拟投60亿元扩产
2026-07-27 10:24:40
据界面新闻报道，红板科技（603459.SH）7月24日连续披露三项投资，总额不超过60亿元：赣州红板拟投不超过50亿元建设高阶mSAP高端精密电路板产业化项目，公司拟投不超过7亿元对吉安现有厂区高精密HDI电路板产线技改扩产，赣州红板另拟投不超过3亿元建设D1栋厂房及辅助设施，资金均来自自有及自筹资金，尚需股东会审议。公司称，50亿元项目预计2027年1月开工、建设期48个月，60亿元约为其2025年营业收入36.77亿元的1.63倍。
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