Pingtung Holdings plans to invest 10 billion yuan to build an AI high-end substrate and flexible printed circuit board manufacturing base in Shenzhen, while its earlier 9.6 billion yuan private placement means the company’s monthly capital spending is nearing 20 billion yuan, according to Jiemian News. The company said the new Shenzhen third industrial park will use land acquired in Bao'an's Yanluo area in May 2026, start construction in July 2026, and begin production in 2033, with funding from internal cash and external financing. Jiemian News reported that the project is aimed at AI substrates and high-end flexible circuit boards to support the AI computing supply chain.
The placement plan announced earlier this month is earmarked for Pingtung's Qingding plant AI server and high-speed optical module HDI substrate project, which is expected to add 655,600 square meters of high-end HDI capacity. Jiemian News said the two projects together would bring the company’s total planned investment to nearly 20 billion yuan in one month. For the first quarter of 2026, Pingtung reported revenue of 7.986 billion yuan, down 1.25% year on year, and net profit attributable to shareholders of 463 million yuan, down 5.21%. The article said the company remains heavily dependent on Apple’s supply chain, while its AI server board business is still behind peers.
Pingtung Holdings Plans 10 Billion Yuan Shenzhen AI PCB Base After 9.6 Billion Yuan Placement
2026-07-24 06:54:14
Disclaimer:
1. The information provided does not constitute investment advice. Investors should make independent decisions and bear all risks themselves.
2. The copyright of this content belongs to the original author. The views expressed herein are solely those of the author and do not represent the stance or position of this website.
