Samsung Electronics' semiconductor division recently formed a BEOL (back-end-of-line) process organization within its etching technology team under the memory business unit.
According to Odaily, the organization is scheduled to be fully established this month and will begin operations at the Pyeongtaek campus, initially comprising around 30 members, most of whom are senior engineers.
The discussions include securing BEOL process technology for high-value memory such as HBM, personnel allocation, and strengthening supply chain operations. BEOL refers to the metal wiring formation process in the later stage of semiconductor front-end processing, used to connect devices and transmit signals after wafer device formation.
Samsung began shipping HBM4 in the first half of this year, with 2,048 I/O, double that of the previous generation. Increasing the number of I/O within a limited chip area requires denser wiring and smaller line widths, imposing higher demands on metal wiring formation and etching precision.
The organization is still in its early formation stage, and specific operational directions and goals will be clarified later.
Samsung Semiconductor Forms BEOL Process Organization for HBM4 Production
2026-07-16 03:34:38
Disclaimer:
1. The information provided does not constitute investment advice. Investors should make independent decisions and bear all risks themselves.
2. The copyright of this content belongs to the original author. The views expressed herein are solely those of the author and do not represent the stance or position of this website.
Previous article：
ETH 7日涨幅超10%，领跑市值前十代币Next article：
SushiSwap新增支持Robinhood Chain
