Tower Semiconductor said on July 14 that it will invest $3 billion to strengthen its chip manufacturing operations in Japan, including a $1 billion grant from the Japanese government.
According to Odaily, the company said the first phase will significantly increase capacity for 300mm silicon photonics devices and is expected to reach full production in the fourth quarter of 2027.
The first phase includes upgrading the former Fab 6 facility to support 300mm silicon photonics device production and advanced packaging capabilities.
The company said the second phase will begin in parallel with the first phase and includes building a new 300mm lithography manufacturing plant next to the Fab 7 facility.
Tower Semiconductor to Invest $3 Billion to Expand Chip Manufacturing in Japan
2026-07-14 12:54:36
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