Samsung Electronics and SK Hynix are re-evaluating when to adopt hybrid bonding technology for next-generation high-bandwidth memory (HBM), South Korean media reported.
According to Odaily, the expected rollout may be delayed further than previously anticipated because demand has eased for thinner HBM designs and improved heat dissipation performance.
The two companies are also developing new cooling approaches, including HPB and iHBM, and plan to apply them to HBM5 products.
Industry sources said hybrid bonding is still viewed as an important medium- to long-term technology path as HBM I/O counts continue to increase.
STOCKS | Samsung Electronics and SK Hynix Reassess Timeline for Hybrid Bonding in Next-Generation HBM
2026-07-06 03:24:45
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