SemiAnalysis称，SPHBM4将复杂的AI芯片工程需求转移到基板层。
据 NS3 报道，芯片制造商可能会逐步减少对专有硅中介层与ABF基板组合方案的采用，转向其他基板层实现路径。
SemiAnalysis：SPHBM4将AI芯片难题转向基板层
2026-07-03 13:51:55
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