China's Sci-Tech Innovation Bond Issuance Hits CNY 994.37 Billion in H1 2026, Data Show
2026-07-03 07:16:37
China's sci-tech innovation bond issuance expanded sharply in the first half of 2026, with 991 bonds issued totaling CNY 994.373 billion, according to 36Kr citing data from Enterprise Early Warning. The data also showed 206 first-time issuers in the period, raising more than CNY 100 billion.
Disclaimer:
1. The information provided does not constitute investment advice. Investors should make independent decisions and bear all risks themselves.
2. The copyright of this content belongs to the original author. The views expressed herein are solely those of the author and do not represent the stance or position of this website.
