据金十数据报道，摩根士丹利发布研报，预估2027年EPYC（霄龙）Venice处理器产量将达到675万颗，高于英伟达Vera的575万颗，多出约17%。
在代工方面，摩根士丹利预估2027年台积电CoWoS封装产能预计升至每月20万片晶圆，英伟达依然是其先进封装的最大客户。
股票市场 | 摩根士丹利：2027年AMD EPYC Venice出货预估超英伟达Vera
2026-06-26 17:24:26
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