BOE A said its glass-substrate packaging carrier board pilot line achieved full automated equipment throughput in the first half of 2026, with designed capacity of 1,000 pieces per month, according to 36Kr. The company said it has connected end-to-end processes including TGV drilling, deep-hole copper filling, build-up and routing, and completed development and sampling in 2025 of a large-size, high-layer-count (9-2-9, 20-layer) glass carrier board.
BOE A said the target product is glass carrier boards for advanced packaging of large-size computing chips. Samples have been delivered to some domestic customers, with some customers having passed concept verification and entering technical testing. The company said it has not yet achieved mass production or revenue from volume production.
BOE A also said its overall depreciation expense will start to decline from the 2025 base, future capital expenditures will gradually decrease, and it has no plan for an equity issuance.
BOE A: Glass Substrate Packaging Pilot Line Reached Full Automation in H1 2026
2026-06-25 10:55:41
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