中信建投：Q1全球半导体设备出货额365.5亿美元
2026-06-23 00:48:30
中信建投研报称，Q1全球半导体设备出货额达365.5亿美元，同比+14%，创历史单季度新高。据36氪报道，SK集团会长崔泰源近日受访表示，若所有建设计划按预期推进，SK海力士产能到2034年将为当前的三倍；研报还称全球半导体设备零部件正经历全链条涨价潮。
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