A domestic copper foil manufacturer’s marketing head said the company’s HVLP fourth-generation computing-power copper foil, used for AI servers and high-speed optical modules, has orders booked through the second half of 2027.
According to Jin10, the executive said copper foil producers typically start with RTF products and then upgrade step by step to HVLP generations 1–2 and 3–4. Each generation requires a verification cycle of 6 to 12 months, and the full process involves 1 to 3 years of system-level certification.
The executive added that overseas chipmakers such as Nvidia, AMD, and Intel, as well as domestic vendors including Huawei Ascend, impose strict requirements on copper foil generation standards, and that only a small number of leading companies worldwide are certified.
AI TRENDS | Copper Foil Maker Says HVLP4 Orders Extend to Late 2027
2026-06-15 12:12:07
Disclaimer:
1. The information provided does not constitute investment advice. Investors should make independent decisions and bear all risks themselves.
2. The copyright of this content belongs to the original author. The views expressed herein are solely those of the author and do not represent the stance or position of this website.
Previous article：
乘联分会崔东树：2026年5月乘用车库存348万辆
