分析师jukan称，TSMC正在建设CoPoS材料、组件和设备供应链，目标于明年实现量产。
据Odaily星球日报报道，据韩国ETNews报道，PLP是在矩形面板上封装已切割芯片的技术，相较于圆形晶圆级封装WLP，可减少边缘区域浪费；以600×600毫米标准矩形面板计算，芯片产出约为主流300毫米12英寸晶圆的5至6倍。
TSMC建设CoPoS供应链，目标明年量产
2026-06-15 05:24:34
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