STOCKS | Li Auto to Issue RMB2 Billion 3-Year Sci-Tech Innovation Bond on June 16
2026-06-15 02:40:06
Li Auto (2015) said it will publicly issue its 2026 first tranche of sci-tech innovation bonds in China’s interbank bond market, with an issuance size of RMB2 billion and a tenor of three years. The debt financing instrument will be issued at par with a subscription range of 1.5%-2.1%, according to Ming Pao, and the issuance date is June 16.
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