BOE Technology Group Co., Ltd. said it has advanced its glass substrate packaging carrier board development and has brought an automated pilot line into operation.
According to Jin10, the company disclosed in an investor relations activity record that it began research into glass substrate carrier board technology in 2020. BOE said it invested 390 million yuan in 2022 to build a wafer-level innovation laboratory platform compatible with glass- and silicon-based processes.
The company said it invested 993 million yuan in 2024 to build a panel-level glass substrate packaging carrier board pilot line, and completed the move-in and commissioning of major equipment within 2025. BOE added that the line achieved full automated equipment throughput in the first half of 2026.
BOE said the pilot line has a designed capacity of 1,000 pieces per month. It also said it has connected the full-process manufacturing flow for glass substrate packaging carrier boards, including TGV drilling, deep-hole copper filling, build-up layering, and circuit routing.
In addition, BOE said it completed development of large-size, high-layer-count (9-2-9, 20-layer) glass substrate carrier board samples and delivered samples in 2025.
STOCKS | BOE Technology Details Progress on Glass Substrate Packaging Carrier Board Pilot Line
2026-06-12 11:02:57
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