Payment service provider Due completed a $7.30 million seed round led by Speedinvest, with participation from Semantic Ventures, Fabric Ventures, Strobe Ventures and Polymorphic Capital.
Due is integrating local payment channels, liquidity markets, and blockchain networks into a unified infrastructure.
Payment service provider Due completes $7.30 million seed round, led by Speedinvest
2025-07-31 02:49:11
Disclaimer:
1. The information provided does not constitute investment advice. Investors should make independent decisions and bear all risks themselves.
2. The copyright of this content belongs to the original author. The views expressed herein are solely those of the author and do not represent the stance or position of this website.
Previous article：
支付服务提供商 Due 完成 730 万美元种子轮融资，Speedinvest 领投Next article：
日本央行维持利率不变，符合市场预期
